EMS is at the root of Prodrive Technologies. Over the years, we have optimized our electronic production and supporting processes to be highly efficient and flexible with superior output quality. We do so by maximizing robotics and continuously monitoring and enhancing our processes.
In the SMD section, we can place up to 100.000 components per hour at each of our ten production lines. Components can vary from 01005 sizes, ultra-fine pitch BGA (0,35mm), up to 288 pins connectors. Soldering is done via a zone-controlled reflow oven. Vacuum and nitrogen soldering are also available to achieve the highest quality possible. We integrate inline x-ray inspection and electrical tests as standard quality control steps in the production lines.
We developed our own bin picking solution for the assembly of through-hole components, enabling automated placement of almost all parts. After automated placement, we solder the components using selective wave soldering and ensure the best solder connection while applying the least thermal stress on the products. All placements and solder connections are checked via solder joint inspection, X-ray inspection, and electrical tests using AET or flying probes.
We also provide other processes related to PCBA manufacturing, such as coating, press-fit component placement, underfill, and bond pad inspection. The processes are fully integrated within Prodrive Technologies’ facilities.
All data from our methods and processes is collected via our Manufacturing Execution System (MES). This data is used to improve our processes, SPC data analysis, and root cause analysis, if necessary.
Within the Prodrive Technologies factory, automated tests and inspection are a key element. In the earliest stage possible, the test strategy on product, system, or machine level is determined based on materials and components used, risks in manufacturing processes, customer quality requirements, and safety requirements.
Test systems that are embedded in our factory concept are:
Prodrive Technologies began to acquire knowledge about die placement and wire bonding almost a decade ago. According to our factory concept, we invested in the most advanced equipment and developed the processes with the highest level of automation and integrated controls on reliability and quality.
Our equipment currently places dice from 1mm x 1mm up to 60mm x 60mm from wafers or a custom supply method. Wire bonding can be done with aluminum, copper, or copper-clad wires with diameters from 20µm up to 500µm or ribbon bonding technologies. Other processes, such as sintering, CO2 cleaning, plasma cleaning, and multiply dispense solutions are also integrated to manufacture total solutions for our customers.