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With our electron beam cameras and detectors, we have achieved new milestones in sensitivity, resolution, and acquisition rate, enabling multi-beam SEM and most sensitive direct detection TEM cameras. Together with our customer we define next generation requirements and set new market standards with our sensor partners. We know what it takes to develop new silicon, complex packaging, and ultra-high vacuum compliant systems. We see silicon design as an integral part of the complete system and can provide sensor design input to achieve the best results in yield, performance, and integration. Our knowledge in packaging, cooling, high-speed, high-density vacuum-feedthroughs, and system integration makes us the best partner.
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