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For MEMS and sensor integration we offer high performance, robust, and cost-effective packaging methods with various die-attach techniques. For vacuum packaging, functional packaging, and active alignment (MOEMS) it is essential to have knowledge of both packaging and MEMS design, for which we offer early-stage MEMS design support. We can include sensing and actuation circuitry by offering hybrid packaging technology, enabling the most advanced MEMS and sensor performance.

Also see our packaging solutions.

MEMS Solutions & Sensor integration

  • Die Attach & Bonding
  • Ultra High Vacuum Applications
  • Micro Assembly
  • Concept Optimization