SiC Module Range
Silver sintered SiC power modules with high heat conductivity and applicable as a TH component on power PCBs
Resistant to large Tj temperature variations
Operable up to high Tj temperatures (175 °C)
Enables very high power densities
Direct integration on PCB possible
Traditionally, power modules are built using soldering and wirebonding. However, wirebond lift-off and solder fatigue are the two main failure modes occur through thermal cycling. We have removed these failure modes by using silver sintering for the dies and interconnects, while at the same time improving the thermal pathway.
These modules are manufactured on flexible but fully automated production lines, to ensure stable production parameters and thus quality, while offering the flexibility of manufacturing multiple product configurations with just in time manufacturing principle.
Finally, the modules have been designed in such a way that they can be utilized as TH components directly on the PCB for easy and high power density integration.
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