MEMS and Sensor Integration

询价

Die Attach & Bonding

Ultra High Vacuum Applications

Micro Assembly

Concept Optimization

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产品描述

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For MEMS and sensor integration we offer high performance, robust, and cost-effective packaging methods with various die-attach techniques. For vacuum packaging, functional packaging, and active alignment (MOEMS) it is essential to have knowledge of both packaging and MEMS design, for which we offer early-stage MEMS design support. We can include sensing and actuation circuitry by offering hybrid packaging technology, enabling the most advanced MEMS and sensor performance.

产品配置

浦卓科技除提供标准化产品,还可根据需求定制产品,为您提供最大的灵活性。无论需要何种产品,我们都可以与您合作满足这些需求。凭借被广泛认可的科技以及新的技术理念,浦卓科技不断地研发出超出客户预期的客制化解决方案,始终站在时代的前沿。您可以放心地将我们的技术应用到您的解决方案中。在过去 的 20 多年里,我们研发过各种产品、系统和解决方案,积累了大量专业经验,为每一位客户提供更好的服务。此外,我们通常可以直接用极为可靠的现成解决方案帮助您。当然,您也可以随时要求我们根据您的具体业务和需求进行研发。

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World Class Performance

Outstanding quality for all our products.

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Optical Solutions

Smallest form factor, best resolution achieved. We optimize solutions through custom design, manufacture and validate optical assemblies in-house.

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Communication Interfaces

We offer several communication options, tailored to customer needs.

Can we answer your questions?  Contact us and we will be in touch. 

 

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