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Advanced Packaging

Our packaging knowledge allows for the most challenging integration of semiconductor components. We provide packaging solutions for opto- and microelectronic modules, optimized for performance, cost, and series production.

Equipped with top-level cleanroom production capabilities, we can provide solutions for the smallest formfactor and complex optical assemblies for imaging and photonics system.

  • ISO 5 and ISO 7 cleanroom facilities
  • Wafer back-end processing
  • Various die-attach methods
    • Gluing
    • Soldering
    • Flip-chip
  • Wire bonding
  • Active alignment
  • Interferometry measurements
  • SEM and EDX
  • Plasma cleaning

We have experience in a great variety of products such as extremely large imagers, mirrors, prisms, filters, and fiber optic plates. In addition, we have the capability to design sophisticated custom optical components. This can be applied for comprehensive illuminators with specific beam shaping capabilities or in other applications requiring high resolution color accurate lens assemblies for imagers. Regardless of your requirements we can go from concept to design and finally to series with highest quality with our automated production capabilities.

Application and solutions include:

  • Metrology
  • Microscopy
  • Life science imaging
  • Automotive sensors
  • Custom image cameras
  • Custom lens assemblies
  • Chip-on-board
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Wirebonding

Advanced Packaging for Camera Solutions

Small, smaller, smallest. Our packaging knowledge allows solutions for the most challenging integration of semiconductor components. Optimized for performance & cost for series production.

  • Optimize for Industrial Level Production
  • Assembly Process Development
  • Die Attached & Wirebonding
  • Ultra-High Vacuum Compatibility