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产品

MEMS and Sensor Integration

For MEMS and sensor integration we offer high performance, robust, and cost-effective packaging methods with various die-attach techniques. For vacuum packaging, functional packaging, and active alignment (MOEMS) it is essential to have knowledge of both packaging and MEMS design, for which we offer early-stage MEMS design support. We can include sensing and actuation circuitry by offering hybrid packaging technology, enabling the most advanced MEMS and sensor performance.

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Die Attach & Bonding
Ultra High Vacuum Applications
Micro Assembly
Concept Optimization

组态

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