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Zeus第三代Xeon 可扩展平台以2U的形式封装两个双宽高端GPU，应用于图像处理和人工智能等计算密集型应用。它具有很长的生命周期来支持各种嵌入式应用。同时我们支持包括主板BIOS、服务器管理软件(BMC)和外部机械结构的定制。
单击此处了解有关我们如何通过与Intel合作的 Zeus Xeon 第三代可扩展系列在图像处理和人工智能方面表现出色的更多信息，或下载下面的解决方案简介。
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| Prodrive Zeus 3rd Gen Intel® Xeon® Scalable |
| CPU | Dual 3rd Generation Intel® Xeon® Scalable Processor |
| Socket | Dual LGA4189-4 |
| Type | DDR4 (L)RDIMM up to 3200MT/s DDR-T/PMEM up to 2933MT/s |
| Size | Up to 2TB over 8 DIMM sockets per CPU |
| Chipset | Intel® C621A |
| BMC | ASPEED AST2500 for Prodrive Server Management |
| Ethernet | 1x 1000BASE-T port (CPU), NC-SI to BMC supported 1x 1000BASE-T port (BMC) |
| USB | 1x USB2.0 (front) 2x USB3.0 (rear) |
| RS-232 | 1x RS-232 (rear) |
| Video | 1x VGA 1920x1200 @60Hz (rear) |
| OLED | 1x OLED screen for diagnostics |
| PSU | Up to 2x 2000W (redundant) |
| AC input | 100-127V, 200-240V (50-60Hz) |
| SAS/SATA/NVMe |
Up to 8x SATA/NVMe compatible ports 8x 2.5” Hot-Swappable Drive Bays |
| RAID | RAID 0/1/5/10 via iRST Virtual RAID on CPU (Intel VROC) support |
| PCIe slots |
Internal: Rear panel: |
| M.2 slot |
1x M.2 SATA/4x PCIe3.0 slot (2280/M-key) |
| Form Factor | 19", 2U |
| Width | 425 mm |
| Height | 87 mm |
| Depth | 780 mm |
| Operating Ambient Temperature | 10-35 ºC |
| Operating Humidity | 35-85% (non-condensing) |
| SEMI | SEMI F47 |
| Safety/EMC | EN/IEC55032 EN/IEC55035 EN/IEC62368-1:2014 CISPR32/35 FCC CFR 47 part 15:2012 |
| Substances | RoHS, REACH |
| Marks | CE, UL, FCC (standard) CCC/CQC, KC, PSE, BSMI, C22.2 (on request) |
