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The demand for more computing power is constantly increasing. As processors and computers become faster—critical for advancing artificial intelligence—integrated circuits (ICs) are being pushed to their limits. The semiconductor industry is currently operating at the 3 nm node in logic, but even smaller technologies are on the horizon, taking us into the Angstrom era.
Future devices will require smaller critical dimensions (CD), the integration of new materials, and 3D device architectures, including the stacked gate-all-around (GAA) structure in logic and 3D-NAND devices in memory.
Plasma etching and deposition will remain the primary method for pattern transfer of increasingly smaller lithographic features for the foreseeable future. These plasma processes are one of the key steps in semiconductor manufacturing but face increasing challenges in meeting the demand for greater accuracy.
How does Prodrive Technologies’ revolutionary solution address these challenges while reducing power consumption and simplifying system complexity?
Download the white paper to discover how we achieve high uniformity and reach high yields.
Or talk to our experts to get more detailed information.
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