Semiconductor

Lithography

Lithography is a process used in microfabrication to pattern parts on a thin film or the bulk of a substrate by light projection on a photoresist. It is the most critical process in semiconductor manufacturing and requires extreme precision.

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Deposition

In the deposition process, thin layers of material are applied to the surface of the wafer. Deposition can be achieved by chemical (Chemical Vapour Deposition) and physical (Physical Vapour Deposition) methods.

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Etching

The etching process takes place after the lithography step. Etching is a chemical process that removes a thin layer on the wafer, leaving the desired pattern on the wafer. Depending on the photoresist that has been used, either the exposed or the non-exposed part of the wafer is removed in the etching step.

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Wafer inspection

Manufacturing semiconductors is an advanced and highly complex process. Process yield is an extremely important parameter. Inspecting wafers after each critical step in the production process is key for yield management.

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Subfab

Most auxiliary equipment is placed in the subfab, mainly due to lack of space on the tightly conditioned fab floor. The products in our portfolio comply with the specific requirements of the subfab, such as process water specifications and placement of connections.

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